CMP
- abbr.Command Module Pilot 指挥舱驾驶员；Computed Maximum Pressure 计算的最大压力；Corrugated Metal Pipe 波纹金属管 网络解释.冠军；共中心点；金属波纹管；凸轮轴转角传感器
双语例句
- 1 . The CMP process is also used to control film thickness and removal of barrier layers.
- CMP技术也用于控制薄膜厚度及剥离隔离层.
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- CMP技术也用于控制薄膜厚度及剥离隔离层.
- 2 . The copper chemical - mechanical polishing ( CMP ) which is the key planarization technology for ULSI manufacturing was discussed.
- 对用于甚大规模集成电路(ULSI) 制造的关键平坦化工艺———铜化学机械抛光 ( CMP) 技术进行了讨论.
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- 3 . Mathematical models were developed to simulate particle reduction in CMP slurry distribution systems.
- 为模拟cmp磨料 分配系统的粒子减少开发了数字模型.
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- 4 . Recent investigation shows that CeC & gt ; 2 nanoparticles can be used as CMP slurry to polish IC chip.
- 最新研究表明,纳米 CeO _2可用于集成电路芯片加工的化学机械抛光(CMP)浆料.
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